Quality inspection
In-process Control
- IPQC
- Chemical laboratory
- Physical Laboratory
- Micro-section
- Lamination thickness measurement
- L/S measurement control
- CMI control copper thickness
- Impedance control measurement
Reliability Tests
- Thermal stress test 288℃ 10 sec.
- Ionic contamination test
- IR reflow test
- Electrical test
- Peeling tests on solder mask & legend ink
- Hi-pot test
- Impedance TDR measurement by
Polar CITS500S &Polar CITS900S4
- Impedance TDR measurement by
Agilent E5063A ENA Series network analyzer
QA Department & Function
