Process capabilities

HDI-SBU Microvias Capability

Formed using laser drill with via filled copper plating.
Plated filled blind microvia advantage.

• Reduces capture pad size of fine pitch BGA.
  By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.
  

• Reduces board real estate for slimming and portability purposes.
  By reducing the board size and weight of the product, it improves the electrical performance of  the system.

• Increases reliability
  Providing stacked vias allows stronger interconnections and obtains better thermal management.
  This also significantly increases board reliability at more severe operation circumstances.