Site de production

Production délai court prototype et petite série

  • Ingénénierie échantillons & prototypes.
  • Simple face jusqu'à 42 couches.
  • 2 équipes de production : 24 / 24 H , 7 / 7 jours.

Des produits et des services diversiviées

  • Fourniture de plusieurs matériaux (i.e., PTFE, Teflon, etc.) pour applications hyperfréquences, metal core, Flex-rigid etc. Et encore plus de ce que vous pouvez imaginer.

Qualité irréprochable & produits fiables

  • Support Qualité performant
  • Fournitire de circuits imprimés de grande fiabilité

Livraison ponctuelle !

  • L'excellence dans le respect de la date de livraison indiquée.       

Production & equipement

ProcessEquipementQuantity

CAM engineering

Par CAM (IGI), InCAM

Film laser plotter (EIE SWISS)

30

3

Film Sec

UV exposure machine

LDI (laser direct image)

Thin core pre-treatment line

Thin core etch/strip line

CCD camera (punch A/W)

Dry film laminator

Automatic dry film laminator

Thin core dry film developing line

4

2

1

1

1

3

1

1

AOI (Inspection Optique)

CAMTEK Orion 706 (6/6 mils)

CAMTEK Orion 868 (4/4 mils)

Orbotech Discovery-OLB (1.6/1.6 mil)

Orbotech Fusion 22 (1/1 mil)

1

1

1

2

Or (Au)

Electrolytic hard gold plating line

Electrolytic soft gold plating line

Immersion gold plating line (ENIG)

1

1

1

 Lamination

Automated black oxidation line

Vacuum lamination hot press (Vigor)

Vacuum lamination cold press (Vigor)

Vacuum high-speed lamination machine (Vigor)-Flex PCB

Dual x-ray target drilling system (AbleTek) 

1

6

1

1

1

Perçage

NC drilling machine (160K RPM) Tongtai;Spindle number:

NC drilling machine (160K RPM) Takisawa;Spindle number:

NC drilling machine (200K  RPM) Via tecnology;Spindle number: (2014)

Pre-treatment (belt scrubbing & micro-etch)

Laser drill (Mitsubishi-ML605GTWⅡ-H)

X-ray (registration controller)

40

6

6

1

1

1

Métallisation

Chemical desmear (permanganate) & PTH line 

Plasma desmear (2014)

High-pressure hydraulic de-burr line

Surface copper subtracted line

Panel plating line

Acid cupric chloride etching line

HDI via filled copper plating (Two baths)

HDI via filled copper plating (one bath)

Pattern plating line

Alkaline ammonia etching line

1

1

1

1

1

1

1

1

1

1

Vernis épargne

Surface pre-treatment line

Semi-auto printing machine

UV exposure machine (7 KW)

Optical alignment exposure machine (8 KW)

Solder mask developing line

LED direct imaging (SCREEN)(2014)

1

4

2

1

1

1

Marquage

Printing workstation (manual)

UV exposure machine (3 KW) for stencil

Inkjet legend printer (Sprint-100 Orbotech)

3

1

2

 Découpe

CNC router machine (18 spindles)

Beveling machine

V-groove machine

6

1

1

Test électrqiue

Dedicated tester (SINK)

Flying probe type testers

Emma (ELX6146-limitation by 5 mils)

Emma (E4M6151-limitation by 2 mils)(2014)

Mania (U8-Board size 24” x 27” Max.)

1

7

1

1

TDR contrôle

Polar CITS500S

Polar CITS900S4

Agilent E5063A ENA Series network analyzer (2014)

1

1

1

FQC

Hole counter

IR reflow

Final cleaning machine

1

1

1

Emballage

Vacuum packaging machine

 2