Capacité de production

Specifications & capabilities

Process capabilities

 

Process capabilities

 

Process capabilities

Material Aluminum base

Material Aluminum base

Plating shut

Material Aluminum base

Blind & Burried 4+N+4 Laser drill

 TU768 0.039” ±0.004” Thick

Material Aluminum base

Special (lateral) counter board

Material Aluminum base

Blind & Burried 1+FLEX+1 Laser drill

Material Aluminum base

MATERIAL—Ro3003+FR4 PP—Ro3001 bonding film+FR4 PP

Material Aluminum base

BOARD THICKNESS(Special)-7.62mm(300mils)

Material Aluminum base

Blind & Burried 9+2+9 Laser drill

Material Aluminum base

Blind & Burried 2+6+2 Laser drill

Material Aluminum base

HDI-SBU Microvias Capabilité

Perçage Laser et remplissage des vias avec cuivre.
Avantage des Microvias borgne rempli et métallisé en surface (VIPPO).

  • Reduces capture pad size of fine pitch BGA.
        By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.
  • Reduces board real estate for slimming and portability purposes.
        By reducing the board size and weight of the product, it improves the electrical performance of  the system.
  • Increases reliability
        Providing stacked vias allows stronger interconnections and obtains better thermal management.
        This also significantly increases board reliability at more severe operation circumstances.