QuALITY INSPECTION

In-process Control 

  • IPQC
  • Chemical laboratory
  • Physical Laboratory
  • Micro-section
  • Lamination thickness measurement
  • L/S measurement control
  • CMI control copper thickness
  • Impedance control measurement 

 

Reliability Tests 

  • Thermal stress test 288℃ 10 sec.
  • Ionic contamination test
  • IR reflow test
  • Electrical test
  • Peeling tests on solder mask & legend ink
  • Hi-pot test
  • Impedance TDR measurement by
        Polar CITS500S &Polar CITS900S4
  • Impedance TDR measurement by
        Agilent E5063A ENA Series network analyzer

 

 

 

QA Department & Function

QA Department & Function