Main production facilities

Quickturn prototype & small volume production

  • Engineering samples & prototypes.
  • Single-sided up to 42-layer count.
  • Operating in two shifts: 24 hours a day, 7 days a week.

Diversified products and services

  • Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave  applications, metal core, rigid-flex, etc. Achieving more than you can imagine.

Highest quality & reliable products

  • Impeccable quality system support
  • Delivering high reliability PCBs

On-time delivery

  • All that the name implies is quickness.       

Process & equipment

ProcessEquipementQuantity

CAM engineering

Par CAM (IGI), InCAM

Film laser plotter (EIE SWISS)

30

3

Dry film

UV exposure machine

LDI (laser direct image)

Thin core pre-treatment line

Thin core etch/strip line

CCD camera (punch A/W)

Dry film laminator

Automatic dry film laminator

Thin core dry film developing line

4

2

1

1

1

3

1

1

AOI system

CAMTEK Orion 706 (6/6 mils)

CAMTEK Orion 868 (4/4 mils)

Orbotech Discovery-OLB (1.6/1.6 mil)

Orbotech Fusion 22 (1/1 mil)

1

1

1

2

Gold plating

Electrolytic hard gold plating line

Electrolytic soft gold plating line

Immersion gold plating line (ENIG)

1

1

1

 Lamination

Automated black oxidation line

Vacuum lamination hot press (Vigor)

Vacuum lamination cold press (Vigor)

Vacuum high-speed lamination machine (Vigor)-Flex PCB

Dual x-ray target drilling system (AbleTek) 

1

6

1

1

1

 Drilling

NC drilling machine (160K RPM) Tongtai;Spindle number:

NC drilling machine (160K RPM) Takisawa;Spindle number:

NC drilling machine (200K  RPM) Via tecnology;Spindle number: (2014)

Pre-treatment (belt scrubbing & micro-etch)

Laser drill (Mitsubishi-ML605GTWⅡ-H)

X-ray (registration controller)

40

6

6

1

1

1

 Copper plating 

Chemical desmear (permanganate) & PTH line 

Plasma desmear (2014)

High-pressure hydraulic de-burr line

Surface copper subtracted line

Panel plating line

Acid cupric chloride etching line

HDI via filled copper plating (Two baths)

HDI via filled copper plating (one bath)

Pattern plating line

Alkaline ammonia etching line

1

1

1

1

1

1

1

1

1

1

Solder mask

Surface pre-treatment line

Semi-auto printing machine

UV exposure machine (7 KW)

Optical alignment exposure machine (8 KW)

Solder mask developing line

LED direct imaging (SCREEN)(2014)

1

4

2

1

1

1

 Silkscreen

Printing workstation (manual)

UV exposure machine (3 KW) for stencil

Inkjet legend printer (Sprint-100 Orbotech)

3

1

2

 Fabrication

CNC router machine (18 spindles)

Beveling machine

V-groove machine

6

1

1

Electrical test 

Dedicated tester (SINK)

Flying probe type testers

Emma (ELX6146-limitation by 5 mils)

Emma (E4M6151-limitation by 2 mils)(2014)

Mania (U8-Board size 24” x 27” Max.)

1

7

1

1

TDR measurement

Polar CITS500S

Polar CITS900S4

Agilent E5063A ENA Series network analyzer (2014)

1

1

1

FQC

Hole counter

IR reflow

Final cleaning machine

1

1

1

Shipping

Vacuum packaging machine

 2